・Komori America and SERIA exhibited at SEMICON WEST 2025 under the theme of micro-printing technology.
・The number of exhibiting companies exceeded 1,500--an increase of 45% from the previous year--and attendance reached a record high of approximately 40,000 visitors.
・Introduced solutions such as solder bump printing, heat sink printing using copper pillars, and via filling using vacuum printing.
・The booth attracted attention with actual printed samples, confirming the potential to contribute to new manufacturing processes in the U.S. market.

This event is an international semiconductor exhibition held annually as a platform for global industry leaders to showcase the latest technologies and strengthen collaboration. This year marked its first time in Phoenix, a city gaining attention as a new hub for the U.S. semiconductor industry. The number of exhibitors exceeded 1,500 companies, up 45% from the previous year, and attendance reached a record high of approximately 40,000 visitors, symbolizing the acceleration of semiconductor investment in the U.S. Komori America and SERIA exhibited under the theme of "Micro-Printing Technology," which is essential for semiconductor manufacturing, and introduced the following solutions:

・Solder bump printing using a gravure offset printing press (a device capable of printing fine patterns with high precision) for connecting semiconductor chips to substrates using tiny metal particles called solder bump.
・Heat sink printing using copper pillars (column-shaped components made of copper) for thermal dissipation.
・Via filling for conductive and heat-dissipating purposes using a vacuum printing press.

Exhibition panel

These technologies play a critical role in meeting the demands for miniaturization and high performance in semiconductors. In particular, micro-printing technology is a key enabler for chiplet technology, a major trend in the industry that combines multiple small semiconductor chips to achieve higher performance.
At the booth, actual printed samples were displayed for visitors to examine firsthand, attracting interest from semiconductor-related companies seeking solutions to technical challenges and new innovations.

Left: solder bump printing, heat sink printing; Right: via filling.

Through this exhibition, we strongly feel that Komori Group's technologies have strong potential to contribute to new manufacturing processes in the U.S. market. Moving forward, Komori Group will continue to address challenges in manufacturing through print technology and propose solutions that deliver higher precision and efficiency in line with the continued growth of the semiconductor industry.

［Related information］
Company Information：SERIA